The Contract Packaging Association (CPA) announces the latest release of its landmark State of the Industry report, which expands on 2017 research, forecasts further into the industry’s future and provides insights for anyone involved in contract packaging.
The interpack alliance trade fairs, organized by Messe Düsseldorf, Messe Düsseldorf India and the Indian Institute of Packaging, are preparing for success.
Twenty-one Technology Excellence Awards finalists in seven categories will be highlighted during PACK EXPO International and Healthcare Packaging EXPO 2018 with show attendees serving as the ultimate final judge.
The Institute of Packaging Professionals (IoPP) is continuing its partnership with PACK EXPO International and Healthcare Packaging EXPO, set for this October 14-17, at the McCormick Place Center in Chicago.
Produced by three of the world’s trade show leaders, PACK EXPO, Anuga, and the International Dairy Food Association (IDFA), the three-day event showcases cutting-edge crossover technologies and innovative solutions from 450 exhibitors over 150,000 net square feet of exhibit space in Chicago, Ill. next March.
PACK EXPO International and co-located Healthcare Packaging EXPO (Oct. 14–17, 2018; McCormick Place, Chicago) registration is now open. Produced by PMMI, The Association for Packaging and Processing Technologies, the shows feature more than 1.2 million net square feet of exhibit space.
Rapid advances in Industrial Internet of Things (IIoT) technology is bringing connected devices, systems and people together to deliver actionable results and improve safety, productivity, sustainability, efficiency and reliability. Coupled with the emergence of IIoT is a continuous evolution of standards to help original equipment manufacturers (OEMs) build safer machines and likewise, help machine users and manufacturers improve the ease of maintenance while minimizing operational downtime. Today, machine users and manufacturers not only want to ensure new and existing machines are safe, but that they are connected for diagnostics, flexible in design, reliable and ready for now as well as the future.